Packaging Module Development Engineer Jobs in United States

11 Packaging Module Development Engineer jobs in United States, taken from 1 employers' own career pages.

Open roles: 11
Employers: 1
Remote: 0%
Typical pay: $99k–220k
Verified live (7d): 11

Pay is advertised by 100% of these postings (11 of 11 in USD), so read it as what is offered rather than what is paid.

Open roles

Packaging Module Development EngineerIntel CorporationUS, AZ$99k–189kPosted 2 days agovia workday
Packaging Module Development EngineerIntel CorporationUS, AZ$134k–220kPosted 7 days agovia workday
Packaging Module Development EngineerIntel CorporationUS, AZ$99k–163kPosted 8 days agovia workday
Packaging Module Development EngineerIntel CorporationUS, AZ$134k–189kPosted 13 days agovia workday
Packaging Module Development EngineerIntel CorporationUS, OR$115k–220kPosted 14 days agovia workday
Packaging Module Development EngineerIntel CorporationUS, AZ$115k–220kPosted 14 days agovia workday
Packaging module development engineerIntel CorporationUS, AZ$99k–189kPosted 16 days agovia workday
Packaging Module Development EngineerIntel CorporationUS, AZ$134k–189kPosted 19 days agovia workday
Packaging Module Development EngineerIntel CorporationUS, AZ$85k–163kPosted 27 days agovia workday
Packaging Module Development EngineerIntel CorporationUS, AZ$134k–255kPosted 39 days agovia workday
Packaging Module Development EngineerIntel CorporationUS, AZ$115k–220kPosted 39 days agovia workday

Employers hiring for this

Intel Corporation11