Packaging Module Development Engineer Jobs in US, AZ

10 Packaging Module Development Engineer jobs in US, AZ, taken from 1 employers' own career pages.

Open roles: 10
Employers: 1
Remote: 0%
Typical pay: $99k–220k
Verified live (7d): 10

Pay is advertised by 100% of these postings (10 of 10 in USD), so read it as what is offered rather than what is paid. It is in line with the United States median for this role ($115k).

Open roles

Packaging Module Development EngineerIntel CorporationUS, AZ$99k–189kPosted 2 days agovia workday
Packaging Module Development EngineerIntel CorporationUS, AZ$134k–220kPosted 7 days agovia workday
Packaging Module Development EngineerIntel CorporationUS, AZ$99k–163kPosted 8 days agovia workday
Packaging Module Development EngineerIntel CorporationUS, AZ$134k–189kPosted 13 days agovia workday
Packaging Module Development EngineerIntel CorporationUS, AZ$115k–220kPosted 14 days agovia workday
Packaging module development engineerIntel CorporationUS, AZ$99k–189kPosted 16 days agovia workday
Packaging Module Development EngineerIntel CorporationUS, AZ$134k–189kPosted 19 days agovia workday
Packaging Module Development EngineerIntel CorporationUS, AZ$85k–163kPosted 27 days agovia workday
Packaging Module Development EngineerIntel CorporationUS, AZ$134k–255kPosted 39 days agovia workday
Packaging Module Development EngineerIntel CorporationUS, AZ$115k–220kPosted 39 days agovia workday

Employers hiring for this

Intel Corporation10